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7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

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7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

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Brand Name : ZIITEK

Model Number : TIF7140PUS thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Name : 7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

Applications : CPU PC GPU

Material : Ceramic filled silicone elastomer

Thermal conductivity : 7.5W/m-K

Thickness : 3.5 mmT

keyword : Thermal conductive gap pad

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7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

Ziitek TIF7140HP use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF700PUS-data sheet.pdf

7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

Features

> Good thermal conductive: 7.5 W/mK

> Thickness: 3.5 mmT

> hardness:20

> Colour: gray

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar

Typical Properties of TIF7140HP Series
Color
 Blue
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.2 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness

3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

20
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity

7.5W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
≥6000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.5MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
≥ 3.5X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.5 W/m-K
GB-T32064
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

7.5W/m.K Cooling Thermal Conductive Silicone Laptop Gap Filler Pad

FAQ

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.


Product Tags:

7.5W/m.K Thermal Conductive Silicone Pad

      

Laptop Thermal Conductive Silicone Pad

      

Silicone Laptop Gap Filler Pad

      
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