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Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES

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Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES

Name: Silicone Thermal Conductive Gap Pad In IT Infrastructure 40mmT 15 WMK TIF116001ES
Brand: ZIITEK
Price: 1 USD

Buy cheap Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES product

Brand Name : ZIITEK

Model Number : TIF1160-01ES

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 1.5 W/m-K

Hardness : 12±5 Shore 00

Density : 1.9 g/cm3

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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thermal conductive gap pad in IT infrastructure ,4.0mmT,1.5 W/m-K TIF1160-01ES silicone pads

The TIF1160-01ES is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

TIF100-01ES-Series-Datasheet.pdf

Features

> Good thermal conductive: 1.5 W/mK

>Thickness:4.0mmT

>hardness:12±5 shore00

>Colour:drak gray

>RoHS compliant

>UL recognized

>Soft and compressible for low stress applications

Applications

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling】

>RDRAM memory modules

>Micro heat pipe thermal solutions

>Automotive engine control units

Typical Properties of TIF1160-01ES Series
Color	drak gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone rubber	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	1.9 g/cm³	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	4.0mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	12±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgassing(TML)	0.30%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	2.9 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES

Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES

silicone thermal conductive gap pad

1.5 W/m-K thermal conductive gap pad

1.5 W/m-K thermal gap filler pad

Silicone Thermal Conductive Gap Pad In IT Infrastructure 4.0mmT 1.5 W/M-K TIF1160-01ES Images