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3.0 W/Mk Thermally Conductive Gap Filler For Handheld Portable Electronics

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3.0 W/Mk Thermally Conductive Gap Filler For Handheld Portable Electronics

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Brand Name : ZIITEK

Model Number : TIF1180-30-06US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 3.0 W/m-K

Hardness : 18 Shore 00

Density : 3.0 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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professional factory Broad range of hardnesses available thermal gap filler for Handheld portable electronics,3.0 W/mK

The TIF1180-30-06US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-30-06US.pdf


Features

> Good thermal conductive: 3.0 W/mK

>Thickness:4.5mmT

>hardness:18 shore00

>Colour: white

>RoHS compliant

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

Applications

>cooling components to the chassis of frame

>High speed mass storage drives

>Heat Sinking Housing at LED-lit BLU in LCD

>LED TV and LED-lit lamps

>RDRAM memory modules

>Micro heat pipe thermal solutions

Typical Properties of TIF1180-30-06US Series
Color
white
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
4.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
18 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

3.0 W/Mk Thermally Conductive Gap Filler For Handheld Portable Electronics

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.


Product Tags:

3.0 w/mk thermally conductive gap filler

      

electronics thermally conductive gap filler

      

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