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3.0mmT Thermal Gap Pad Conductive For CD-Rom

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3.0mmT Thermal Gap Pad Conductive For CD-Rom

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Brand Name : ZIITEK

Model Number : TIF1120-20-10UF thermal pad

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Volume Resistivity : 1.0X10^12 Ohm-cm

keyword : thermal gap pad

Dielectric Constant : 4.6 MHz

name : 3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom

Construction & Compostion : Ceramic filled silicone elastomer

Fire rating : 94 V0

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3.0mmT Soft and Compressible for Low Stress Applications Conductive Pads for CD-Rom

The TIF1120-20-10UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

TIF100-20-10UF-Datasheet-REV02.pdf

Features

> Good thermal conductive: 2.0 W/mK

>Thickness: 3.0mmT

>hardness:75 shore 00

>Colour: Gray

>Moldability for complex parts
>Soft and compressible for low stress applications
>Naturally tacky needing no further adhesive coating

Applications

>Automotive electronics

>Set top boxes

>Audio and video components

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

Typical Properties of TIF1120-20-10UF Series
Color
 gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.7 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.6 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
2.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

3.0mmT Thermal Gap Pad Conductive For CD-Rom

FAQ:

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.


Product Tags:

3.0mm thermal gap pad

      

CD Rom thermal gap pad

      

3.0mm silicone thermal pad

      
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