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2.0mmT Pink / White Thermal Gap Pad For RDRAM Memory Modules

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2.0mmT Pink / White Thermal Gap Pad For RDRAM Memory Modules

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Brand Name : ZIITEK

Model Number : TIF280-20-02ES thermal pad

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

name : 2.0mmT Pink/White Outstanding Thermal Performance Thermal Pad for RDRAM Memory Modules

part number : TIF280-20-02ES

Dielectric Constant : 5.0 MHz

hardness : 10 Shore 00

Applications : Automotive engine control units

keyword : thermal gap pad

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2.0mmT Pink/White Outstanding Thermal Performance Thermal Pad for RDRAM Memory Modules

The TIF280-20-02ES use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF200-20-02ES-Series-Datasheet.pdf

Features

> Good thermal conductive: 2.0 W/mK

>Thickness: 2.0mmT

>hardness:10 shore 00

>Colour: Pink/White

>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance

Applications

>cooling components to the chassis of frame

>High speed mass storage drives

>Heat Sinking Housing at LED-lit BLU in LCD

>LED TV and LED-lit lamps

>RDRAM memory modules

>Micro heat pipe thermal solutions

Typical Properties of TIF280-20-02ES Series
Color
 Pink/White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.8 g/cm3

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
2.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

10 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
2.0W/mk
ISO22007-2.2
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

5.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

2.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.

Our vast experience allows us to assist our customers best in thermal engineering field.

We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

2.0mmT Pink / White Thermal Gap Pad For RDRAM Memory Modules

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.


Product Tags:

2.0mm Thermal Pad

      

RDRAM Modules Thermal Gap Pad

      

UL Automotive Thermal Gap Pad

      
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