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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

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Brand Name : ZIITEK

Model Number : TIF7140Z thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Name : Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

Thickness : 3.5mmT

Thermal conductivity : 7.0 W/m-K

Material : silicone

Applications : CPU Cooling

keyword : Thermal Silicone Insulation Pad

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Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

The TIF7140Z use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF700Z-Series-Datasheet(E)-REV01.pdf

Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

Features

> Good thermal conductive: 7.0 W/mK

> Thickness: 3.5mmT

> hardness:55 shore 00

> Colour: Grey

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

Typical Properties of TIF7140Z Series
Color
Grey
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.45 g/cc

ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.5mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

55 Shore 00

ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Thermal conductivity
7.0W/mk
ASTMD5470
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

4.5MHz

ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
5.2X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity

7.0 W/m-K

GB-T32064
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Silicone Insulation Pad for GPU CPU Cooling Pad Low Thermal Resistance

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.


Product Tags:

Low Thermal Resistance Insulation Pad

      

GPU CPU Cooling Insulation Pad

      

CPU Cooling Thermal Silicone Insulation Pad

      
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