Low shrinkage 2.0W/mK One Component Dealcoholized Room Temperature Cured

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Low shrinkage 2.0W/mK One Component Dealcoholized Room Temperature Cured

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Low shrinkage 2.0W/mK One Component Dealcoholized Room Temperature Cured

One Component Dealcoholized Room Temperature cured Thermally Conductive Silicone Adhesive TIS™580-20 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. ...

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2.0W/mK Thermally Conductive silicone Adhesive

One Component Thermally Conductive silicone Adhesive

Low shrinkage Thermally Conductive silicone Adhesive

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