3.0 W/M-K Thermal Gap Filler TIF1100-30-11ES For Memory Modules

Product Categories

Phase Changing Materials [40]
Thermal Conductive Pad [164]
Thermal Gap Filler [196]
Thermal Conductive Grease [27]
Thermal Insulation Materials [48]
Thermal Graphite Sheet [56]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Dongguan Ziitek Electronic Materials & Technology Ltd.

Visit Website

City: Dongguan

Province/State: Guangdong

Country/Region: China

View Contact Details

3.0 W/M-K Thermal Gap Filler TIF1100-30-11ES For Memory Modules

Contact Now

3.0 W/M-K Thermal Gap Filler TIF1100-30-11ES For Memory Modules

good performance thermal gap filler TIF1100-30-11ES,3.0 W/m-K for Memory Modules The TIF1100-30-11ES use a special process, with silicone as the base material, adding thermal conductive powder and ...

Product Tags:

thermal gap filler 3.0 W/m-K

thermal gap filler for Memory Modules

thermal gap pad For Memory Modules

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!